Electronic Contract Manufacturers

Every Griffith product is developed and manufactured using a proprietary process referred to as a Manufacturing Assembly Plan (MAP). Through close, detailed interactions with customer designers and engineers, Griffith creates a MAP to clearly define cost-effective processes that lead to consistently replicable high product quality products. We have achieved and maintained a 99% or better on-time delivery record with our customers.

Our manufacturing and engineering capabilities include:

• Electronics packaging and mechanical analysis of printed circuit boards
• Electronics packaging, including thermal control, shock and vibration isolation
• Machine and mechanical design
• Corrosion control
• Failure analysis and trouble-shooting
• Electrical circuit design for analog and digital systems, including cable and interconnect system and EMI, EMP, ESD and HIRF protection design
• Printed circuit design assembly
• ESD-controlled environment
• Conformal coating applications per J-STD/IPC610